This product delivers excellent thermal resistance, offers high thermal conductivity
and virtually no evaporation over a wide operating temperature range.
Heat sink pastes and heat sink grease are designed to efficiently transfer heat away from the heat generating component. For electrical applications, the heat sink compound is used to thermally bond a component with a mechanical heat sink. The compound fills the gap between the CPU (central processing unit) or other heat generating components. In addition, heat sink compounds are used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required. Although heat sink paste does not have the thermal conductivity of metals like copper and silver, the improvement over the air will increase thermal responsiveness.
TC-10X is recommended for high-temperature heat transfer in normal applications. It is used between heat generating devices and the surfaces to which they are mounted or other heat dissipating surfaces. This product delivers excellent thermal resistance, offers high thermal conductivity and virtually no evaporation over a wide operating temperature range. It is nonflammable oil based compound which is oxidation resistant and does not promote rust or corrosion.
TC-30X is recommended for high-temperature heat transfer in normal applications. It is used between heat generating devices and the surfaces to which they are mounted or other heat dissipating surfaces. This product delivers excellent thermal resistance, offers high thermal conductivity and virtually no evaporation over a wide operating temperature range. It is nonflammable oil based compound which is oxidation resistant and does not promote rust or corrosion.
Solder paste is typically used in a stencil-printing process, in which paste is deposited over a stainless steel or polyester mask to create the desired pattern on a printed circuit board. The paste may be dispensed pneumatically, by pin transfer (where a grid of pins is dipped in solder paste and then applied to the board), or by jet printing (where the paste is sprayed on the pads through nozzles, like an inkjet printer).
As well as forming the solder joint itself, the paste carrier/flux must have sufficient tackiness to hold the components while the assembly passes through the various manufacturing processes, perhaps moved around the factory.
Printing is followed by pre-heating and reflow (melting).
Formula Sn63-Pb37 is a mildly activated resin-based formulation designed specifically to allow post-process residues to be left on the PCB without degradation. Sn63-Pb37 has a wide process window uncommon to most non-clean solder pastes, which allows it to accommodate a variety of environments and process applications. Sn63-Pb37 performs well in continuous production, offering good slump resistance, high tack, and low post-process residues. The post soldering residues are compatible with ICT (In Circuit Testing). Sn63-Pb37 is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours.
Formula Sn42-Bi58 is a mildly activated resin-based formulation designed specifically to allow post-process residues to be left on the PCB without degradation. Sn42-Bi58 has a wide process window uncommon to most no-clean solder pastes, which allows it to accommodate a variety of environments and process applications. Sn42-Bi58 performs well in continuous production, offering good slump resistance, high tack, and low post-process residues. The post soldering residues are compatible with ICT (In Circuit Testing). Sn42-Bi58 is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours.
Solder Bar is made solely from high purity metal, produces a low proportion of dross and its suitable for dip and wavesoldering. ... Solder Bar is available specification in A grade, S grade, Anti-oxide bar, Silver added bar, Pure Tinbar and other Lead Free Solder Bar.
Solder wire is comprised of different alloys, or of pure tin. Each metal requires a certain type of soldering wire to create strong bonds, because the combinations of metals that comprise soldering wire melt at different temperatures.
