This product delivers excellent thermal resistance, offers high thermal conductivity
and virtually no evaporation over a wide operating temperature range.
Heat sink pastes and heat sink grease are designed to efficiently transfer heat away from the heat generating component. For electrical applications, the heat sink compound is used to thermally bond a component with a mechanical heat sink. The compound fills the gap between the CPU (central processing unit) or other heat generating components. In addition, heat sink compounds are used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required. Although heat sink paste does not have the thermal conductivity of metals like copper and silver, the improvement over the air will increase thermal responsiveness.
TC-10X is recommended for high-temperature heat transfer in normal applications. It is used between heat generating devices and the surfaces to which they are mounted or other heat dissipating surfaces. This product delivers excellent thermal resistance, offers high thermal conductivity and virtually no evaporation over a wide operating temperature range. It is nonflammable oil based compound which is oxidation resistant and does not promote rust or corrosion.
Solder Bar is made solely from high purity metal, produces a low proportion of dross and its suitable for dip and wavesoldering. ... Solder Bar is available specification in A grade, S grade, Anti-oxide bar, Silver added bar, Pure Tinbar and other Lead Free Solder Bar.